HCA datasheet, HCA circuit, HCA data sheet: TI – OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS,alldatasheet, datasheet. HCA Datasheet, HCA PDF, HCA Data sheet, HCA manual, HCA pdf, HCA, datenblatt, Electronics HCA, alldatasheet, free, datasheet. HCA. −40°C to 85°C. SOIC − DW. Reel of SN74HCADWR semiconductor products and disclaimers thereto appears at the end of this data sheet.

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Important Information and Disclaimer: This site uses cookies to deliver services in accordance with the Cookie Files Policy. Instapak – polyurethane filling adjusts to the shape and datashret of transported device ensuring maximum protection. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

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HC573A PDF Datasheet浏览和下载

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Repair history Upon the request we will provide you with the repair history of your product. The information provided on this page represents TI’s knowledge and belief as of the date that it is provided. Device is in production to support existing customers, but TI does not recommend using this part in.

Product device recommended for new designs. Upon your request we can order dedicated courier to fasten the delivery Long warranty All used devices devices have month warrantywhich can be expanded to 24 months.

Rapid delivery We dispatch the items on the same day. Flat rate repair Consistent repair price, implementation always in time! Our own service We repair all the products in Wroclaw.

Short lead time In emergencies every minute is crucial. You can set the conditions for storage and access to cookies in your browser settings. TI’s terms “Lead-Free” or “Pb-Free” mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.

Technical support Help to choose correct products Assembling and installation option If you have any questions, please contact our customer service: TI has discontinued the dagasheet of the device. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the. This component has a RoHS exemption for either 1 lead-based flip-chip solder bumps used between the die and package, or 2 lead-based die adhesive used between the die and leadframe.


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Device is in production to support existing customers, but TI does not recommend using this part in a new design. Thanks to long co-operation with UPS, we established unique forms and ways of packing products for the transport.

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HCA (TI) PDF技术资料下载 HCA 供应信息 IC Datasheet 数据表 (1/19 页)

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Not recommended for new designs. We are equipped with the most advanced tools used by the most experienced catasheet. How should I prepare the device to transport?